Influence of cooling rate and annealing on the DSC Tg of an epoxy resin

• Autores: Qi Tao, Gerald Pinter, Thomas Krivec
• Localización: Microelectronics reliability, ISSN 0026-2714, Nº. 78, 2017, págs. 396-400
• Idioma: inglés
• Texto completo no disponible (Saber más ...)
• Resumen

  • Abstract Glass transition temperature (Tg) is a key epoxy property and often being monitored in the production by the differential scanning calorimeter (DSC) method in the printed circuit board (PCB) industry. The dual-effect of cooling rate and annealing on the endothermic peak in the DSC scan of CE-688 epoxy resin plays a big role in the DSC Tg evaluation. An improved DSC program was developed in order to minimize/eliminate the influence of endothermic peak. Meanwhile, the curing pressure also shows distinct effect on the Tg of the epoxy resin.