Numerical investigation of bimaterial interfacial crack with interaction of voids and inclusions using XFEM

• Autores: Achchhe Lal, M.A. M. Shafei Vaghela
• Localización: Mechanics based design of structures and machines, ISSN 1539-7734, Vol. 51, Nº. 8, 2023, págs. 4183-4213
• Idioma: inglés
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• Resumen

  • This article is presented to investigate the influence of several discontinuity like interfacial-crack, void and inclusion in the bimaterial plate, to analyze the normalized mixed-mode stress intensity factor (NMMSIFs) using XFEM under the uniaxial tensile load with considering the several numerical problems. It is investigated the normalized stress intensity factors (NSIFs) for an isotropic bimaterial plate and NMMSIFs for an isotropic-orthotropic bimaterial plate through varying the single-multi voids/inclusions position while its above, aligned and away from the interfacial edge crack and center crack of the bimaterial plate. It is also analyzed the void/inclusion several shape influence in the bimaterial plate. It is observed higher and fluctuating SIFs obtained with more number of voids/inclusions, influence of elliptical and diamond shape of void/inclusion is higher.