Differential scanning calorimetry and dinamic mechanical analysis of phenol-resorcinol-formaldehyde resins

• JUSTO LISPERGUER ^[1] ; CYNTHIA DROGUETT ^[2] ; BEATRIZ RUF ^[1] ; MARIO NUÑEZ ^[3]
  1. [1] Universidad del Bio Bio Facultad de Ciencias
  2. [2] Universidad del Bio Bio Dirección de Transferencia Tecnológica
  3. [3] Centro de Investigaciones de Polímeros Avanzados

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• Localización: Journal of the Chilean Chemical Society (Boletín de la Sociedad Chilena de Química), ISSN-e 0717-6309, ISSN 0366-1644, Vol. 50, Nº. 2, 2005, págs. 451-453
• Idioma: inglés
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  • Differential scanning calorimetry ( DSC ) and dinamic mechanical analysis ( DMA ) were use to study the curing reactions of two phenol - resorcinol- formaldehyde ( PRF ) adhesives with 15 and 25 % resorcinol content, synthesized in laboratory. The PRF resin with lower resorcinol content ( PRF1 ) shows a double exothermic peak ( 99.9 and 158.2 °C ) while PRF2 ,with greater resorcinol content ( 25 %) shows only one peak at 93.9 °C. The DMA storage modulus E' confirm the differences in the curing behavior of PRF adhesives. In the delamination resistance test during accelerated exposure only PRF2 with a greater content of resorcinol, fulfilled the ASTM D 2559 requirements for beams treated with two CCA retention levels. The cross-linking reactions was produced in the curing process at lower temperature in PRF2 , enhanced the adhesion durability to glulams treated with CCA preservatives