Design and performance of the CMS pixel detector readout chip
B. Meier, W. Erdmann, H.Chr. Kästli, M. Barbero, D. Kotlinski, R. Horisberger, Ch. Hörmann
págs. 188-194
G. Traversi, M. Manghisoni, F. Morsani, R. Cenci, F. Forti, S. Bettarini, V. Speziali, L. Ratti, M.A. Giorgi, G. Calderini, L. Bosisio, V. Re, G. Rizzo
págs. 195-201
págs. 202-211
T. Speer, V. Chiochia, D.A. Sanders, K. Prokofiev, S. Cucciarelli, C. Hörmann, L. Cremaldi, A. Dorokhov, C. Regenfus, S. Son, T. Rohe, M. Konecki, D. Kim, D. Bortoletto, Y. Allkofer, M. Swartz, D. Kotlinski
págs. 212-220
Characterization of a thinned back illuminated MIMOSA V sensor as a visible light camera
Aldo Mozzanica, Massimo Caccia, Michele Bianda, Fabio Risigo, Antonio Bulgheroni, Chiara Cappellini, Renzo Ramelli
págs. 221-226
TCT characterization of different semiconductor materials for particle detection
P. Weilhammer, J. Fink, N. Wermes, H. Krüger, P. Lodomez, H. Pernegger
págs. 227-233
Hybrid photon detectors for the LHCb RICH
Stephan Eisenhardt
págs. 234-240
Naidu Bezawada, Jörg Stegmeier, Alan Moorwood, James Garnett, Gert Finger, Reinhold Dorn, Guy Woodhouse, Manfred Meyer, Leander Mehrgan
págs. 241-250
pnCCD for photon detection from near-infrared to X-rays
Gerhard Lutz, Robert Hartmann, Robert Andritschke, Lothar Strüder, Norbert Meidinger, Peter Holl, Sven Herrmann
págs. 251-257
Tatsuro Hiruta, H. Ikeda, T. Takasima, T. Takahashi, K. Nakazawa, K. Tamura
págs. 258-262
Analysis of noise characteristics for the active pixels in CMOS image sensors for X-ray imaging
Jun-Hyung Bae, Young Soo Kim, Gyuseong Cho
págs. 263-267
An optical sensor for the ATLAS muon spectrometer: The reference alignment system
Phillipe Schune, Alexandre Richardson, Patrick Ponsot, Florian Bauer, Claude Guyot, Michel Fontaine, Thierry Lerch, Pierre-Francois Giraud, Valérie Gautard, Olivier Cloué, Jean-Christophe Barrière
págs. 268-271
Active-edge planar radiation sensors
J. Morse, C.J. Kenney, S. Watts, C. Da Via, J. Hasi, E. Westbrook, J.D. Segal, Sherwood Parker
págs. 272-277
Radiation hard diamond sensors for future tracking applications
A. Gorisek, C. Colledani, E. Borchi, C. Furetta, F. Fizzotti, V. Dabrowski, E. Griesmayer, P. D¿Angelo, F. Huegging, E. Grigoriev, V. Eremin, B. van Eijk, F. Hartjes, H. Frais-Kölbl, J. Hrubec, K.K. Gan, W. Dulinski, M. Bruzzi, W. de Boer, W. Adam
págs. 278-283
págs. 284-289
Flip chip bumping technology¿Status and update
M. Juergen Wolf, Gunter Engelmann, Herbert Reichl, Lothar Dietrich
págs. 290-295
Analysis of the production of ATLAS indium bonded pixel modules
A. Andreazza, E. Ruscino, C. Gemme, A. Fiorello, L. Rossi, A. Paoloni, G. Corda, P. Nechaeva, S. Di Gioia, G. Alimonti, F. Manca, A. Rovani, C. Meroni, M. Koziel, A. Bulgheroni
págs. 296-302
Development of an Indium bump bond process for silicon pixel detectors at PSI
Ch. Broennimann, R. Horisberger, M. Horisberger, J. Gobrecht, S. Streuli, T. Rohe, J. Lehmann, F. Glaus, H.C. Kästli, S. Heising
págs. 303-308
Experience in fabrication of multichip-modules for the ATLAS pixel detector
H. Reichl, J. Wolf, M. Lutz, I. Kuna, H. Oppermann, O. Ehrmann, J. Röder, F. Defo Kamga, R. Jordan, M. Töpper, T. Fritzsch
págs. 309-313
Experiences in flip chip production of radiation detectors
Satu Savolainen-Pulli, Jaakko Salonen, Sami Vähänen, Jorma Salmi
págs. 314-319
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