págs. 1-11
págs. 12-18
págs. 19-24
págs. 25-37
págs. 38-48
Comphy — A compact-physics framework for unified modeling of BTI
G. Rzepa, J. Franco, B. O’Sullivan, A. Subirats, M. Simicic, Geert Hellings, P. Weckx, M. Jech, T. Knobloch, M. Waltl, P.J. Roussel, D. Linten, B. Kaczer, T. Grasser
págs. 49-65
Junyeap Kim, Hanbin Yoo, Heesung Lee, Seong Kwang Kim, Sungju Choi, Sung-Jin Choi, Dae Hwan Kim, Dong Myong Kim
págs. 66-70
págs. 71-83
págs. 84-92
Sub-1 ns characterization methodology for transistor electrical parameter extraction
Yiming Qu, Bing Chen, Wei Liu, Jinghui Han, Jiwu Lu, Yi Zhao
págs. 93-98
págs. 99-108
Design, manufacture and test for reliable 3D printed electronics packaging
Tim Tilford, Stoyan Stoyanov, Jessica Braun, Jan Christoph Janhsen, Matthias Burgard, Richard Birch, Chris Bailey
págs. 109-117
A reverse hysteresis effect of graphene transistors with amorphous silicon gate dielectric
Qingwei Zhang, Ping Li, Yongbo Liao, Gang Wang, Rongzhou Zeng, Heng Wang
págs. 118-121
Zero-maintenance of electronic systems: Perspectives, challenges, and opportunities
Richard McWilliam, Samir Khan, Michael Farnsworth, Colin Bell
págs. 122-139
págs. 140-147
págs. 148-155
págs. 156-162
Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation
págs. 163-175
págs. 176-189
págs. 190-197
págs. 198-206
A generalized degradation model based on Gaussian process
Zhihua Wang, Qiong Wu, Xiongjian Zhang, Xinlei Wen, Yongbo Zhang, Chengrui Liu, Huimin Fu
págs. 207-214
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