Study on fatigue life and electrical property of COG assembly under thermal–electric–mechanical coupled loads
- Autores: Hong Gao, Wenguo Zhang, Zhe Zhang, Lilan Gao, Gang Chen
- Localización: Microelectronics reliability, ISSN 0026-2714, Nº. 56, 2016, págs. 148-154
- Idioma: inglés
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Resumen
AbstracIt is well-known that chip-on-glass (COG) assembly is often subjected to the coupled effects of temperature, electrical current and cyclic mechanical loading in service. Therefore, the fatigue life and electrical property of COG assembly undergoing thermal–electric–mechanical coupled loads have been studied in the present work. Based on the present investigations, it was found that that the relative resistance of COG assembly in the fatigue process displayed different trends according to environmental temperature and mechanical loading amplitude. Moreover, the fatigue life of the COG assembly decreased with the increased temperature and the increased loading amplitude. Finally, the Basquin's equation can predict the fatigue life of COG assembly at different environmental temperatures well.
