Improvement of multicores throughput based on environmental conditions

• Autores: Piotr Kocanda, Andrzej Kos
• Localización: Microelectronics reliability, ISSN 0026-2714, Nº. 60, 2016, págs. 78-83
• Idioma: inglés
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  • Abstract This article deals with a new, simple and effective method of throughput improvement. The method can be applied in every kind of single and multicore processors. It does not require any integration into integrated circuit topology only modification consists of additional placement of temperature sensor in a heat sink. A simple algorithm controls processor's power in such a way that it utilizes full physical ability of integrated circuits working under thermal constraints. Some theoretical investigations are verified by practical experiments.