Integrating physical level design and high level synthesis for simultaneous multi-cycle transient and multiple transient fault resiliency of application specific datapath processors

• Autores: Deepak Kachave, Anirban Sengupta
• Localización: Microelectronics reliability, ISSN 0026-2714, Nº. 60, 2016, págs. 141-152
• Idioma: inglés
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  • Abstract Radiation induced faults in digital systems have started gathering major attention in recent years due to increasing reliability concern for future technologies. For future technologies, multiple transient faults (MTF) originating from a single radiation hit are expected to occur more frequently. Further, due to continuous massive scaling in device geometry, a particle with moderate linear energy transfer (LET) values is expected to affect more than one module/device during striking. Additionally, incessant escalation in operating speed with evolution of technology has increased likelihood of multi-cycle transient (MCT) faults in digital circuits. This calls for novel solutions for concurrently tackling multi-cycle transient and multi-transient fault resiliency at a higher design abstraction level such as behavioral level. This paper proposes a novel approach for generating simultaneous multi-cycle transient and multiple transient fault resilient designs during high level synthesis (HLS) of application specific datapath processors using the framework of dual modular redundancy. Results of the proposed approach on benchmarks indicated generation of low cost MCT–MFT resilient designs during HLS within acceptable runtime.