Ball-grid-array solder joint model for assembly-level impact reliability prediction

• Autores: Chee Kuang Kok, Wen Jie Ng, Chin Chin Ooi, Kia Wai Liew
• Localización: Microelectronics reliability, ISSN 0026-2714, Nº. 65, 2016, págs. 184-191
• Idioma: inglés
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• Resumen

  • Abstract It has been well established that lead-free solder underperforms conventional leaded solder in reliability under dynamic impact. Common failures observed on ball-grid-array (BGA) solder balls on chip under board level impact include bulk solder ductile failure, intermetallic (IMC) layer crack and pad-lift. In this work, a finite element modeling approach was proposed to model bulk solder ductile failure and intermetallic layer crack. The use of beam elements and connector elements to represent the bulk solders and board/component side intermetallic layers, respectively, offers the advantage of simplicity over the use of continuum elements and cohesive elements for solder joints. This approach enables the modeling of assembly level impact with significantly less computational resources. The model was verified by comparing its prediction of BGA solder reliability against actual test results in a dynamic four-point bend test. The physical tests consist of ball impact at varying heights on a board with a mounted chip, and the subsequent analysis of the failure modes of the BGA solder joints. Simulation results were in good agreement with test results. The study shows that it is feasible to model BGA solder joint ductile failure and intermetallic layer crack under impact with simple elements with reasonable accuracy.