Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints

• Autores: Mingna Wang, Jianqiu Wang, Wei Ke
• Localización: Microelectronics reliability, ISSN 0026-2714, Nº. 73, 2017, págs. 69-75
• Idioma: inglés
• Texto completo no disponible (Saber más ...)
• Resumen

  • Abstract The aim of this study is to evaluate the corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder joint using salt spray test. The presence of Cu pad accelerates the dissolution of Sn from solder joints into corrosive medium because of galvanic corrosion mechanism. So, the solder joint was easily corroded in corrosive environment than SAC305 solder bar. During salt spray test, pitting corrosion begin from the solidification cracks in the solder joints, which will lead to a decrease of the reliability of solder joints and shorten the life of electronic devices.