Microelectronics reliability

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  Año 2017, Número 73

  • Performance analysis of heat pipe aided NEPCM heat sink for transient electronic cooling

    K.R. Suresh Kumar, R. Dinesh, A. Ameelia Roseline, S. Kalaiselvam

    • Resumen

    págs. 1-13

    

  • Automatic characterisation method for statistical evaluation of tin whisker growth

    Olivér Krammer, Balázs Illés, Réka Bátorfi, Karel Dušek

    • Resumen

    págs. 14-21

    

  • Single event transient effects on charge redistribution SAR ADCs

    Thales E. Becker, Alisson J.C. Lanot, Guilherme S. Cardoso, Tiago R. Balen

    • Resumen

    págs. 22-35

    

  • Similarities of lag phenomena and current collapse in field-plate AlGaN/GaN HEMTs with different types of buffer layers

    Ryouhei Tsurumaki, Naohiro Noda, Kazushige Horio

    • Resumen

    págs. 36-41

    

  • Advancement in simulating moisture diffusion in electronic packages under dynamic thermal loading conditions

    Jing Wang, Ruiyang Liu, Dapeng Liu, Seungbae Park

    • Resumen

    págs. 42-53

    

  • Thermal impedance measurement of integrated inductors on bulk silicon substrate

    M. Kałuża, B. Wiecek, G. de Mey, A.T. Hatzopoulos, V. Chatziathanasiou

    • Resumen

    págs. 54-59

    

  • Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of warpage and tilt in flip chip thermo-compression bonding

    Ari Laor, Depayne Athia, Alireza Rezvani, Horst Clauberg, Michael Mayer

    • Resumen

    págs. 60-68

    

  • Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints

    Mingna Wang, Jianqiu Wang, Wei Ke

    • Resumen

    págs. 69-75

    

  • Static fault localization of subtle metallization defects using near infrared photon emission microscopy

    A.C.T. Quah, D. Nagalingam, J.-S. Moon, E. Susanto, G.B. Ang, S.P. Neo, J. C. Lam, Z.H. Mai

    • Resumen

    págs. 76-91

    

  • A method to recover critical bits under a double error in SEC-DED protected memories

    Shanshan Liu, Pedro Reviriego Vasallo, Liyi Xiao, Juan Antonio Maestro

    • Resumen

    págs. 92-96

    

  • Experimental and numerical investigation of circular minichannel heat sinks with various hydraulic diameter for electronic cooling application

    Seyed Ebrahim Ghasemi, A.A. Ranjbar, M.J. Hosseini

    • Resumen

    págs. 97-105

    

  • Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration

    Fengjiang Wang, Dongyang Li, Shuang Tian, Zhijie Zhang, Jiheng Wang, Chao Yan

    • Resumen

    págs. 106-115

    

  • Research on the effect of single-event transient of an on-chip linear voltage regulator fabricated on 130 nm commercial CMOS technology

    QiFeng Zhao, GuoQing Yang, YongJie Sun, PeiFu Yu, Jianjun Chen, Bin Liang

    • Resumen

    págs. 116-121

    

  • Low-voltage triggering SCRs for ESD protection in a 0.35 μm SiGe BiCMOS process

    Liu Jizhi, Zeng Yaohui, Liu Zhiwei, Zhao Xianming, Cheng Hui, Liu Nie

    • Resumen

    págs. 122-128

    

  • Highly reliable and low-power magnetic full-adder designs for nanoscale technologies

    Ramin Rajaei

    • Resumen

    págs. 129-135

    

  • Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing

    Cheolgyu Kim, Tae-Ik Lee, Min Sung Kim, Taek-Soo Kim

    • Resumen

    págs. 136-145

    

  • Random telegraph noise in SiGe HBTs: Reliability analysis close to SOA limit

    C. Mukherjee, T. Jacquet, A. Chakravorty, T. Zimmer, J. Boeck, Klaus Aufinger, C. Maneux

    • Resumen

    págs. 146-152

    

  • Assessment of sense measurement duration on BTI degradation in MG/HK CMOS technologies using a novel stacked transistor test structure

    Andreas Kerber

    • Resumen

    págs. 153-157

    

  • Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards

    Vadimas Verdingovas, Morten Stendahl Jellesen, Rajan Ambat

    • Resumen

    págs. 158-166