Thermal impedance measurement of integrated inductors on bulk silicon substrate

• Autores: M. Kałuża, B. Wiecek, G. de Mey, A.T. Hatzopoulos, V. Chatziathanasiou
• Localización: Microelectronics reliability, ISSN 0026-2714, Nº. 73, 2017, págs. 54-59
• Idioma: inglés
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• Resumen

  • Abstract The article presents the results of transient thermal measurements of a coil integrated in a silicon chip. Based on those measurements and using numerical procedures, thermal impedance, time constant distribution and structure functions were obtained. Next, using simple physical models of heat transfer phenomena, the 3 major time constants of the device under test were calculated, compared with measurement results and explained physically.