Young's modulus of a sintered Cu joint and its influence on thermal stress

• Autores: T. Ishizaki, D. Miura, A. Kuno, K. Hasegawa, M. Usui, Y. Yamada
• Localización: Microelectronics reliability, ISSN 0026-2714, Nº. 76-77, 2017, págs. 405-408
• Idioma: inglés
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• Resumen

  • Abstract Al2O3 chips and pure Cu plates were joined by Cu nanoparticles at 250 °C and 350 °C, and the Young's moduli of the sintered Cu were evaluated by nanoindentation tests. The average Young's moduli were 52.7 ± 19.8 GPa and 76.5 ± 29.7 GPa at 250 °C and 350 °C, respectively, indicating that the sintered structures were strengthened at higher temperatures. The calculation results indicated that the joint at 350 °C has a high Young's modulus, but make the stress higher than the chip strength, resulting in breakage of the chip during 65/250 °C power cycling.