Thermal behaviors of nanoparticle reinforced epoxy resins for microelectronics packaging

• Autores: Hongzhan An, Zhan Liu, Qing Jiu Tian, Junhui Li, Can Zhou, Xiaohe Liu, Wenhui Zhu
• Localización: Microelectronics reliability, ISSN 0026-2714, Nº. 93, 2019, págs. 39-44
• Idioma: inglés
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• Resumen

  • In order to improve the thermal performance of high-performance high-density microelectronics packaging. Effects of nanoparticle (Al2O3, AlN and SiO2) on heat conductivity coefficient, water absorption, strength and thermal stability of reinforcement EP are investigated. It is revealed that the nanoparticle can improve the thermal and mechanical properties of the studied EP. Compared with Al2O3 and AlN, SiO2 has a stronger influence on the thermal and mechanical properties of EP. With the increase of fraction of SiO2, the heat conductivity coefficient increases gradually, and the mechanical properties first increase and then decrease. The addition of 3% SiO2 is an optimal ratio. It can improve the heat conductivity coefficient four times, and the strength can increase to 86 MPa. In addition, when flip chip die was filled by EP-SiO2 packaging material, the failure life increased 5.5 times than pure EP. The results of this paper will provide practical guidance for improving the performance of packaging materials in microelectronic packages.