Microelectronics reliability

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  Año 2019, Número 93

  • A hybrid coding retransmitted chipless tag loaded by microstrip resonator

    Zhonghua Ma, Cheng-Chih Chen

    • Resumen

    págs. 1-7

    

  • Characteristics and reliability of VDMOS under capacitive loads

    Yulong Zhang, Lulu Wang, Xueqin Gong, Bo Gao, Lixin Wang, Jiajun Luo

    • Resumen

    págs. 8-15

    

  • A cost-efficient error-resilient approach to distributed arithmetic for signal processing

    Yue Lu, Shengyu Duan, Basel Halak, Tom J Kazmierski

    • Resumen

    págs. 16-21

    

  • Improvement in lateral resolution of through-transmission scanning acoustic tomography using capacitive micromachined ultrasound transducer

    Taiichi Takezaki, Masakazu Kawano, Shuntaro Machida, Daisuke Ryuzaki

    • Resumen

    págs. 22-28

    

  • Improving Instruction TLB Reliability with Efficient Multi-bit Soft Error Protection

    Vahdaneh Kiani, Pedro Reviriego Vasallo

    • Resumen

    págs. 29-38

    

  • Thermal behaviors of nanoparticle reinforced epoxy resins for microelectronics packaging

    Hongzhan An, Zhan Liu, Qing Jiu Tian, Junhui Li, Can Zhou, Xiaohe Liu, Wenhui Zhu

    • Resumen

    págs. 39-44

    

  • A BICS-based strategy for mitigating the effects of single event transients on SAR converter

    Jing Gao, Yingguang Ding, Kaiming Nie, Jiangtao Xu

    • Resumen

    págs. 45-56

    

  • A voltage-transient method for characterizing traps in GaN HEMTs

    Xiang Zheng, Shiwei Feng, Yifu Gao, Yamin Zhang, Yunpeng Jia, Shijie Pan

    • Resumen

    págs. 57-60

    

  • Effect of PCB cracks on thermal cycling reliability of passive microelectronic components with single-grained solder joints

    Saeed Akbari, Andreas Lövberg, Per-Erik Tegehall, Klas Brinkfeldt, Dag Andersson

    • Resumen

    págs. 61-71

    

  • Qcrit-independent model method for proton SEU analysis

    Yancun Li, Dengyun Yu, Qingxiang Zhang, Zhenbo Cai, Xiaoyu Jia, Ying Wang

    • Resumen

    págs. 72-80

    

  • Circuit analysis to predict humidity related failures in electronics - Methodology and recommendations

    Salil Joshi, Vadimas Verdingovas, Morten Stendahl Jellesen, Rajan Ambat

    • Resumen

    págs. 81-88

    

  • High robust and cost effective double node upset tolerant latch design for nanoscale CMOS technology

    Hongchen Li, Liyi Xiao, Jie Li, Chunhua Qi

    • Resumen

    págs. 89-97

    

  • Determination of DC equivalent hot carrier stress times in scaled CMOS devices using novel AC stress methodology

    Andreas Kerber, Tanya Nigam

    • Resumen

    págs. 98-101

    

  • Cycle life and statistical predictive reliability model for all-solid-state thin film microbatteries

    Nathanaël Grillon, Émilien Bouyssou, Sébastien Jacques, Gaël Gautier

    • Resumen

    págs. 102-108

    

  • An Android mutation malware detection based on deep learning using visualization of importance from codes

    Yao-Saint Yen, Hung-Min Sun

    • Resumen

    págs. 109-114

    

  • Prediction of relations between leaching rate of rare earth mineral and the density of its mother liquid based on HGEP-PTS algorithm

    Shiliang Zhang, Xiaosheng Liu

    • Resumen

    págs. 115-119