Thermal fracture parameter analysis of MEMS multilayer structures based on the generalized thermoelastic theory

• Autores: Zhang Long, Zhang Xiaomin, Song Jiyun, Zheng Hengwei
• Localización: Microelectronics reliability, ISSN 0026-2714, Nº. 98, 2019, págs. 106-111
• Idioma: inglés
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• Resumen

  • Since the interface crack of thermo-optic switches has significant effect on structure safety when they are heated, the Paper introduces the generalized thermoelastic theory by taking into consideration the non-Fourier effect on microscale heat conduction, so as to establish the bilayer film/substrate structure containing an interface crack model, calculate types I and II stress intensity factors (SIFs) and the energy release rate, and study the effects of different heating powers and film thicknesses on the SIFs and energy release rate of the crack tip. Numerical results show that the SIF increases linearly with the heating power. When the thickness ratio reaches 0.5, the KI of the PMMA film reaches the maximum. When the thickness ratio is less than 0.3, the KI of the thin SiO2 film presents an exponential decline. The energy release rate at the crack tip increases in a quadratic function with the increase of power. The SiO2 film decreases with the increase of the film thickness. When the film thickness ratio reaches 0.5, the energy release rate of the PMMA film reaches the maximum. The above results can provide a theoretical basis for the design of thermo-optic switches and serve as reference for reliability evaluation.