Prediction of deformation during manufacturing processes of silicon interposer package with TSVs
Yeonsung Kim, Ah-Young Park, Chin-Li Kao, Michael Su, Bryan Black, Seungbae Park
págs. 234-242
págs. 243-254
Effect of TiO2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder
M.I.I. Ramli, N. Saud, M.A.A. Mohd Salleh, M.N. Derman, R. Mohd Said
págs. 255-264
págs. 265-273
págs. 274-279
págs. 280-288
págs. 289-309
Microwave effects of UV light exposure of a GaN HEMT: Measurements and model extraction
Alina Caddemi, Emanuele Cardillo, Giuseppe Salvo, Salvatore Patanè
págs. 310-317
págs. 318-326
págs. 327-328
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