A fusion prognostics-based qualification test methodology for microelectronic products

• Autores: Michael Pecht, Tadahiro Shibutani, Myeongsu Kang, Melinda Hodkiewicz, Edward Cripps
• Localización: Microelectronics reliability, ISSN 0026-2714, Nº. 63, 2016, págs. 320-324
• Idioma: inglés
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• Resumen

  • Abstract The global market for microelectronic products is projected to reach US$2.4 trillion per year by 2020. This growth has led to intense competition between manufacturers to minimize the time-to-market for their products. Unfortunately, however, qualification testing, which is time-consuming and resource-intensive, is a major bottleneck for the quick release of microelectronic products to the market. Hence, for both researchers and engineers considering the time with reliability issues during qualification testing, this paper provides a review of conventional methodologies in qualification testing and presents a fusion prognostics-based qualification test methodology that combines the advantages of physics-of-failure and data-driven methods.