Microelectronics reliability

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  Año 2019, Número 97

  • Cache lifetime enhancement technique using hybrid cache-replacement-policy

    Bhukya Krishna Priya, T.S. Sampath Kumar, B. Shameedha Begum, N. Ramasubramanian

    • Resumen

    págs. 1-15

    

  • Thermomigration in Co/SnAg/Co and Cu/SnAg/Co sandwich structure

    Fan-Yi Ouyang, Gong-Lin Hong, Yuan-Ruei Hsu, Shan-Yu Mao, Wei-Jun Liu

    • Resumen

    págs. 16-23

    

  • Building ATMR circuits using approximate library and heuristic approaches

    Iuri Albandes Cunha Gomes, Mayler G. A. Martins, Sergio Cuenca Asensi, Fernanda G. L. Kastensmidt

    • Resumen

    págs. 24-30

    

  • Low delay Single Error Correction and Double Adjacent Error Correction (SEC-DAEC) codes

    Jiaqiang Li, Pedro Reviriego Vasallo, Liyi Xiao, Zhaochi Liu, Linzhe Li, Anees Ullah

    • Resumen

    págs. 31-37

    

  • A method for simulating the influence of grain boundaries and material interfaces on electromigration

    Lado Filipovic

    • Resumen

    págs. 38-52

    

  • A comparative study of lifetime reliability of planar MOSFET and FinFET due to BTI for the 16 nm CMOS technology node based on reaction-diffusion model

    Mohamed Mounir Mahmoud, Norhayati Soin

    • Resumen

    págs. 53-65

    

  • A cloud-based energy data mining information agent system based on big data analysis technology

    Hsueh-Yuan Lin, Sheng-Yuan Yang

    • Resumen

    págs. 66-78

    

  • An observation and explanation of interior cracking at the interface of solder by electromigration

    Qizhi Wang, Qingyi Liu, Zheng Zhang, Min Miao, Yehao Su, Fei Su

    • Resumen

    págs. 79-84