Microelectronics reliability

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  Año 2017, Número 68

  • Morphological and electrical comparison of Ti and Ta based ohmic contacts for AlGaN/GaN-on-SiC HFETs

    A. Pooth, J. Bergsten, N. Rorsman, H. Hirshy, R. Perks, P. Tasker, T. Martin, R.F. Webster, D. Cherns, M.J. Uren, M. Kuball

    • Resumen

    págs. 2-4

    

  • Determination of safe reliability region over temperature and current density for through wafer vias

    C.S. Whitman, Michael G. Meeder, P. J. Zampardi

    • Resumen

    págs. 5-12

    

  • Commercial-off-the-shelf algan/gan hemt device reliability study after exposure to heavy ion radiation

    B. Poling, G.D. Via, K.D. Bole, E.E. Johnson, J.M. McDermott

    • Resumen

    págs. 13-20

    

  • Total Ionizing Dose, Random Dopant Fluctuations, and its combined effect in the 45 nm PDSOI node

    Eleni Chatzikyriakou, William Redman-White, C.H. De Groot

    • Resumen

    págs. 21-29

    

  • A new meshing criterion for the equivalent thermal analysis of GaAs PHEMT MMICs

    Xiuqin Xu, Jiongjiong Mo, Wei Chen, Zhiyu Wang, Yongheng Shang, Yang Wang, Qin Zheng, Liping Wang, Zhengliang Huang, Faxin Yu

    • Resumen

    págs. 30-38

    

  • Heat transfer enhancement of LEDs with a combination of piezoelectric fans and a heat sink

    S.F. Sufian, M.Z. Abdullah

    • Resumen

    págs. 39-50

    

  • Investigation of read disturb in split-gate memory and its feasible solution

    Wenyi Zhu, Binghan Li, Tao Yu, Weiran Kong, Shichan Zou

    • Resumen

    págs. 51-56

    

  • DIRT latch: A novel low cost double node upset tolerant latch

    Nikolaos Eftaxiopoulos, Nicholas Axelos, Kiamal Pekmestzi

    • Resumen

    págs. 57-68

    

  • Microstructure and mechanical properties of Co/Sn-10Bi couple and Co/Sn-10Bi/Co joint

    Zhongmin Lai, Xinda Kong, Qingrong You, Xiubin Cao

    • Resumen

    págs. 69-76

    

  • Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective

    P. Rajaguru, H. Lu, C. Bailey, J. Ortiz-Gonzalez, O. Alatise

    • Resumen

    págs. 77-85

    

  • Durability evaluation of hexagonal WO3 electrode for lithium ion secondary batteries

    Akito Sasaki, Hideyuki Oozu, Miho Nakamura, Katsuaki Aoki, Yoshinori Kataoka, Syuichi Saito, Kumpei Kobayashi, Wei Li, Kuniyuki Kakushima, Kazuo Tsutsui, Hiroshi Iwai

    • Resumen

    págs. 86-90

    

  • Reliability prediction with MTOL

    Joseph B. Bernstein, Alain Bensoussan, Emmanuel Bender

    • Resumen

    págs. 91-97