págs. 1-8
págs. 9-14
págs. 15-21
págs. 22-26
págs. 27-33
págs. 34-43
págs. 44-51
págs. 52-57
Operation of 4H-SiC high voltage normally-OFF V-JFET in radiation hard conditions: Simulations and experiment
págs. 58-66
Junction temperature of QFN32 and 64 electronic devices subjected to free convection: effects of the resin's thermal conductivity
págs. 67-73
Degradation induced by TID radiation and hot-carrier stress in 130-nm short channel PDSOI NMOSFETs
Lihua Dai, Xiaonian Liu, Mengying Zhang, Leqing Zhang, Zhiyuan Hu, Dawei Bi, Zhengxuan Zhang, Shichan Zou
págs. 74-80
págs. 81-81
págs. 82-87
págs. 88-99
Effect of roughness on electrical contact performance of electronic components
Xin-long Liu, Zhen-bing Cai, Shan-bang Liu, Jin-fang Peng, Min-hao Zhu
págs. 100-109
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Guest Editorial: 2016 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
págs. 118-120
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Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components
Bart Vandevelde, Filip Vanhee, Davy Pissoort, Lieven Degrendele, Johan De Baets, Bart Allaert, Ralph Lauwaert, Franco Zanon, Riet Labie, Geert Willems
págs. 131-135
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Reliability of Cu wire bonds in microelectronic packages
A. Mazloum-Nejadari, G. Khatibi, B. Czerny, M. Lederer, J. Nicolics, L. Weiss
págs. 147-154
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Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor
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