Microelectronics reliability

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  Año 2018, Número 82

  • NBTI: Experimental investigation, physical modelling, circuit aging simulations and verification

    C. Schlünder, K. Puschkarsky, G.A. Rott, W. Gustin, H. Reisinger

    • Resumen

    págs. 1-10

    

  • Topological variation on sub-20 nm double-gate inversion and Junctionless-FinFET based 6T-SRAM circuits and its SEU radiation performance

    S. Nilamani, P. Chitra, V.N. Ramakrishnan

    • Resumen

    págs. 11-19

    

  • Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via

    Kazuki Watanabe, Yoshiharu Kariya, Naoyuki Yajima, Kizuku Obinata, Yoshiyuki Hiroshima, Shunichi Kikuchi, Akiko Matsui, Hiroshi Shimizu

    • Resumen

    págs. 20-27

    

  • A review of pulsed NBTI in P-channel power VDMOSFETs

    D. Dankovic, I. Manic, A. Prijić, V. Davidovic, Z. Prijić, S. Golubovic, S. Djoric-Veljkovic, A. Paskaleva, D. Spassov, N. Stojadinovic

    • Resumen

    págs. 28-36

    

  • Micro-Raman spectroscopy applied in crystal structure analysis on the ESD failure mechanism of SiC JBS diodes

    Yunpeng Jia, Zhenhua Lin, Dongqing Hu, Tzung-Yu Wu, Peng Li, Guanghai Liu

    • Resumen

    págs. 37-41

    

  • Technology scaling implications for BTI reliability

    S.M. Ramey, C. Prasad, A. Rahman

    • Resumen

    págs. 42-50

    

  • Thermal lifetime estimation method of IGBT module considering solder fatigue damage feedback loop

    Bing Gao, Fan Yang, Minyou Chen, Yigao Chen, Wei Lai, Chao Liu

    • Resumen

    págs. 51-61

    

  • Review of bias-temperature instabilities at the III-N/dielectric interface

    C. Ostermaier, P. Lagger, M. Reiner, D. Pogany

    • Resumen

    págs. 62-83

    

  • Parameter driven monitoring for a flip-chip LED module under power cycling condition

    J. Magnien, L. Mitterhuber, J. Rosc, F. Schrank, S. Hörth, M. Hutter, S. Defregger, E. Kraker

    • Resumen

    págs. 84-89

    

  • Lifetime estimation of IGBT modules for MMC-HVDC application

    Longjun Wang, Jiayou Xu, Gang Wang, Zheng Zhang

    • Resumen

    págs. 90-99

    

  • Study of the operation and SET robustness of a CMOS pulse stretching circuit

    Marko Andjelkovic, Miloš Krstić, Rolf Kraemer

    • Resumen

    págs. 100-112

    

  • Experimental study on optical-thermal associated characteristics of LED car lamps under the action of ionic wind

    Jing Wang, Yi-xi Cai, Xiao-hua Li, Yun-fei Shi, Ya-chao Bao, Jun Wang, Yun-xi Shi

    • Resumen

    págs. 113-123

    

  • The effect of ionization and displacement damage on minority carrier lifetime

    Jianqun Yang, Xingji Li, Chaoming Liu, D.M. Fleetwood

    • Resumen

    págs. 124-129

    

  • Synergistic effects of NPN transistors caused by combined proton irradiations with different energies

    Xingji Li, Jianqun Yang, Chaoming Liu, Gang Bai, Wenbo Luo, Pengwei Li

    • Resumen

    págs. 130-135

    

  • Humidity build-up in electronic enclosures exposed to different geographical locations by RC modelling and reliability prediction

    H. Conseil-Gudla, Ž. Staliulionis, S. Mohanty, Morten Stendahl Jellesen, J. Hattel, Rajan Ambat

    • Resumen

    págs. 136-146

    

  • A fast fault injection platform of multiple SEUs for SRAM-based FPGAs

    Rongsheng Zhang, Liyi Xiao, Jie Li, Xuebing Cao, Chunhua Qi, Jiaqiang Li, Mingjiang Wang

    • Resumen

    págs. 147-152

    

  • The temperature and oxygen vacancy effects on the diffusion coefficient and ionic conductivity in ferroelectric BaTiO3 nanowires; A molecular dynamics study

    Mehran Gholipour Shahraki, Saeed Ghorbanali

    • Resumen

    págs. 153-158

    

  • 60Co gamma radiation total ionizing dose combined with conducted electromagnetic interference studies in BJTs

    Olarewaju Mubashiru Lawal, Shuhuan Liu, Zhuoqi Li, Aqil Hussain

    • Resumen

    págs. 159-164

    

  • Mössbauer studies of β → α phase transition in Sn-rich solder alloys

    Piotr Zachariasz, Agata Skwarek, Balázs Illés, Jan Żukrowski, Tamás Hurtony, Krzysztof Witek

    • Resumen

    págs. 165-170

    

  • Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment

    Bakhtiar Ali, Mohd Faizul Mohd Sabri, Suhana Mohd Said, Nazatul Liana Sukiman, Iswadi Jauhari, Mohammad Hossein Mahdavifard

    • Resumen

    págs. 171-178

    

  • Fault diagnosis for the motor drive system of urban transit based on improved Hidden Markov Model

    Huang Darong, Ke Lanyan, Chu Xiaoyan, Zhao Ling, Mi Bo

    • Resumen

    págs. 179-189

    

  • Study and analysis of DR-VCO for rad-hardness in type II third order CPLL

    K.A. Karthigeyan, Premanand Venkatesh Chandramani

    • Resumen

    págs. 190-196

    

  • A portable high-density absolute-measure NIRS imager for detecting prefrontal lobe activity under fatigue driving

    Yue Zhao, Guoyi Xu, Yunlong Sun, Boan Pan, Ting Li

    • Resumen

    págs. 197-203

    

  • Ball impact responses of Sn-1Ag-0.5Cu solder joints at different temperatures and surface finishes

    Chin-Li Kao, Tei-Chen Chen

    • Resumen

    págs. 204-212

    

  • Importance of test parameters, specimen type and use configuration on the identification of Sn/Ag solder behaviour laws

    Carmen Martín Marino, Alexandre Micol, Francois Pérès

    • Resumen

    págs. 213-223

    

  • Joule heating dominated fracture behavior change in micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu(Ni) joints under electro-thermal coupled loads

    W.-Y. Li, X.P. Zhang, H.B. Qin, Y.-W. Mai

    • Resumen

    págs. 224-227

    

  • Study of microwave damage effect on HEMT low noise amplifier under different drain voltage bias

    Tao Yan, Yonghua Zhang, Ping Li, Shuai Zhang

    • Resumen

    págs. 228-234

    

  • The effect of epoxy/glass interfaces on CAF failures in printed circuit boards

    Bhanu Sood, Michael Pecht

    • Resumen

    págs. 235-243