págs. 1-11
págs. 12-18
págs. 19-30
págs. 31-43
Study of grain size effect of Cu metallization on interfacial microstructures of solder joints
Zeyang Zheng, Ping-Chen Chiang, Yu-Ting Huang, Wei-Ting Wang, Po-Chien Li, Ya-Hui Tsai, Chih-Ming Chen, Shien-Ping Feng
págs. 44-51
Sense amplifier offset voltage analysis for both time-zero and time-dependent variability
Innocent Agbo, Mottaqiallah Taouil, Daniël Kraak, Said Hamdioui, Pieter Weckx, Stefan Cosemans, Praveen Raghavan, Francky Catthoor, Wim Dehaene
págs. 52-61
Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate
Junghwan Bang, Dong-Yurl Yu, Yong-Ho Ko, Jun-Hyuk Son, Hiroshi Nishikawa, Chang-Woo Lee
págs. 62-73
A thermally-resilient all-optical network-on-chip
Roshanak Karimi, Somayyeh Koohi, Melika Tinati, Shaahin Hessabi
págs. 74-86
págs. 87-95
págs. 96-103
Correctable and uncorrectable errors using large scale DRAM DIMMs in replacement network servers
Sanghyeon Baeg, Mirza Qasim, Junhyeong Kwon, Tan Li, Nilay Gupta, ShiJie Wen, Satyadev Kolli
págs. 104-112
Degradation of AlInAs/InGaAs/InP quantum cascade lasers due to electrode adhesion failure
D. Pierścińska, K. Pierściński, G. Sobczak, P. Gutowski, M. Płuska, M. Bugajski
págs. 113-118
Atmospheric neutron single event effect test on Xilinx 28 nm system on chip at CSNS-BL09
Weitao Yang, Yonghong Li, Yang Li, Zhiliang Hu, Fei Xie, Chaohui He, Songlin Wang, Bin Zhou, Huan He, Waseem A. Khan, Tianjiao Liang
págs. 119-124
págs. 125-131
págs. 132-136
Life prediction of copper wire bonds in commercial devices using principal component analysis (PCA)
Subramani Manoharan, Chandradip Patel, Steven Dunford, John Beshears, Patrick McCluskey
págs. 137-151
págs. 152-160
Shih-Chieh Chao, Wei-Chen Huang, Jen-Hsiang Liu, Jenn-Ming Song, Po-Yen Shen, Chi-Lin Huang, Lung-Tang Hung, Chin-Huang Chang
págs. 161-167
Effect of copper over-pad metallization on reliability of aluminum wire bonds
Fumiyoshi Kawashiro, Kentaro Takao, Tatsuya Kobayashi, Masaaki Yoshikawa, Eitaro Miyake, Yoshiki Endo, Tatsuo Tonedachi, Hiroshi Nishikawa
págs. 168-176
Experimental determination of critical adhesion energies with the Advanced Button Shear Test
Nadine Pflügler, Georg M. Reuther, Michael Goroll, Dominik Udiljak, Reinhard Pufall, Bernhard Wunderle
págs. 177-185
págs. 186-196
págs. 197-202
págs. 203-212
págs. 213-221
págs. 222-231
In-Operando X-ray diffraction imaging of thermal strains in fully packaged silicon devices
B.K. Tanner, K. Vijayaraghavan, B. Roarty, A.N. Danilewsky, P.J. McNally
págs. 232-238
págs. 239-244
págs. 245-261
Life cycle trends of electronic materials, processes and components
Chien-Ming Huang, José A. Romero Paguay, Johannes Michael Ostermann, Diganta Das, Michael Pecht
págs. 262-276
CIRCA: Towards a modular and extensible framework for approximate circuit generation
Linus Witschen, Muhammad Awais, Hassan Ghasemzadeh Mohammadi, Tobias Wiersema, Marco Platzner
págs. 277-290
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