C. Boit

• Artículos de revistas (14)

• Artículos de revistas

  • Non-invasive soft breakdown localisation in low k dielectrics using photon emission microscopy and thermal laser stimulation

    N. Herfurth, K.-C. Wu, A. Beyreuther, T. Nakamura, I. De Wolf, M. Simon-Najasek, F. Altmann, K. Croes, C. Boit

    Microelectronics reliability, ISSN 0026-2714, Nº. 92, 2019, págs. 73-78

    • Resumen
    

  • Contactless parametric characterization of bandgap engineering in p-type FinFETs using spectral photon emission

    A. Beyreuther, I. Vogt, N. Herfurth, T. Nakamura, G.G. Fischer, B. Motamedi, C. Boit

    Microelectronics reliability, ISSN 0026-2714, Nº. 92, 2019, págs. 143-148

    • Resumen
    

  • Device characterization of 16/14 nm FinFETs for reliability assessment with infrared emission spectra

    I. Vogt, T. Nakamura, B. Motamedi, C. Boit

    Microelectronics reliability, ISSN 0026-2714, Nº. 88-90, 2018, págs. 11-15

    • Resumen
    

  • IC security and quality improvement by protection of chip backside against hardware attacks

    E. Amini, A. Beyreuther, N. Herfurth, A. Steiger-Garçao, R. Muydinov, B. Szyszka, C. Boit

    Microelectronics reliability, ISSN 0026-2714, Nº. 88-90, 2018, págs. 22-25

    • Resumen
    

  • Photon emission as a characterization tool for bipolar parasitics in FinFET technology

    A. Beyreuther, N. Herfurth, E. Amini, T. Nakamura, I. De Wolf, C. Boit

    Microelectronics reliability, ISSN 0026-2714, Nº. 88-90, 2018, págs. 273-276

    • Resumen
    

  • Detection of failure mechanisms in 24–40 nm FinFETs with (spectral) photon emission techniques using InGaAs camera

    I. Vogt, T. Nakamura, I. De Wolf, C. Boit

    Microelectronics reliability, ISSN 0026-2714, Nº. 88-90, 2018, págs. 334-338

    • Resumen
    

  • Technologies for Heterogeneous Integration - Challenges and chances for fault isolation

    C. Boit

    Microelectronics reliability, ISSN 0026-2714, Nº. 76-77, 2017, págs. 184-187

    • Resumen
    

  • Optical interaction in active analog circuit elements

    I. Vogt, T. Nakamura, C. Boit

    Microelectronics reliability, ISSN 0026-2714, Nº. 76-77, 2017, págs. 233-237

    • Resumen
    

  • Physical analysis, trimming and editing of nanoscale IC function with backside FIB processing.

    R. Schlangen, R. Leihkauf, U. Kerst, T. Lundquist, P. Egger, C. Boit

    Microelectronics reliability, ISSN 0026-2714, Vol. 49, Nº. 9-11, 2009, págs. 1158-1164

    

  • Characterization of stress degradation effects and thermal properties of AlGaN/GaN HEMTs with photon emission spectral signatures.

    A. Glowacki, P. Laskowski, C. Boit, P. Ivo, E. Bahat-Treidel, R. Pazirandeh, R. Lossy, J. Würfl, G. Tränkle

    Microelectronics reliability, ISSN 0026-2714, Vol. 49, Nº. 9-11, 2009, págs. 1211-1215

    

  • Detectability of dynamic photon emission in static Si CCD for signal path determination in integrated circuits.

    P. Laskowski, A. Glowacki, C. Boit

    Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 8-9, 2008, págs. 1295-1299

    

  • Comparison of laser voltage probing and mapping results in oversized and minimum size devices of 120 nm and 65 nm technology.

    U. Kindereit, C. Boit, U. Kerst, S. Kasapi, R. Ispasoiu, R. Ng, W. Lo

    Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 8-9, 2008, págs. 1322-1326

    

  • Timing analysis of scan design integrated circuits using stimulation by an infrared diode laser in externally triggered pulsing condition.

    T. Kiyan, C. Brillert, C. Boit

    Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 8-9, 2008, págs. 1327-1332

    

  • Non destructive 3D chip inspection with nano scale potential by use of backside FIB and backscattered electron microscopy.

    R. Schlangen, U. Kerst, C. Boit, T. Malik, R. Jain, T. Lundquist

    Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 9-11, 2007, págs. 1523-1528

    

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