W.D. van Driel

• Artículos de revistas (27)

• Artículos de revistas

  • Special issue: International conference on thermal, mechanical & multiphysics simulation and experiments in micro- and nano-electronics and systems [EuroSimE2017]

    W.D. van Driel, Artur Wymysłowski

    Microelectronics reliability, ISSN 0026-2714, Nº. 87, 2018, págs. 321-321

    

  • A review on discoloration and high accelerated testing of optical materials in LED based-products

    M. Yazdan Mehr, M.R. Toroghinejad, F. Karimzadeh, W.D. van Driel, G.Q. Zhang

    Microelectronics reliability, ISSN 0026-2714, Nº. 81, 2018, págs. 136-142

    • Resumen
    

  • Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products

    M. Yazdan Mehr, M.R. Toroghinejad, F. Karimzadeh, W.D. van Driel, G.Q. Zhang

    Microelectronics reliability, ISSN 0026-2714, Nº. 78, 2017, págs. 143-147

    • Resumen
    

  • Color shift acceleration on mid-power LED packages

    Guangjun Liu, W.D. van Driel, Xuejun Fan, Jiajie Fan, Cheng Qian, G.Q. Zhang

    Microelectronics reliability, ISSN 0026-2714, Nº. 78, 2017, págs. 294-298

    • Resumen
    

  • Lumen maintenance predictions for LED packages

    W.D. van Driel, M. Schuld, B. Jacobs, F. Commissaris, J. van der Eyden, B. Hamon

    Microelectronics reliability, ISSN 0026-2714, Nº. 62, 2016, págs. 39-44

    • Resumen
    

  • Creep fatigue models of solder joints: A critical review

    E.H. Wong, W.D. van Driel, A. Dasgupta, M. Pecht

    Microelectronics reliability, ISSN 0026-2714, Nº. 59, 2016, págs. 1-12

    • Resumen
    • Texto completo
    

  • Comparing drop impact test method using strain gauge measurements.

    Y. Liu, F.J.H.G. Kessels, W.D. van Driel, J.A.S. Van Driel, F.L. Sun, G.Q. Zhang

    Microelectronics reliability, ISSN 0026-2714, Vol. 49, Nº. 9-11, 2009, págs. 1299-1303

    

  • Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull.

    J.J.M. Zaal, H.P. Hochstenbach, W.D. van Driel, G.Q. Zhang

    Microelectronics reliability, ISSN 0026-2714, Vol. 49, Nº. 8, 2009, págs. 846-852

    

  • Advances in the drop-impact reliability of solder joints for mobile applications.

    E.H. Wong, S.K.W. Seah, W.D. van Driel, J.F.J.M. Caers, N. Owens, Y.-S. Lai

    Microelectronics reliability, ISSN 0026-2714, Vol. 49, Nº. 2, 2009, págs. 139-149

    

  • Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP.

    F. Sun, P. Hochstenbach, W.D. van Driel, G.Q. Zhang

    Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 8-9, 2008, págs. 1167-1170

    

  • On chip�package stress interaction.

    W.D. van Driel, D.G. Yang, G.Q. Zhang

    Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 8-9, 2008, págs. 1268-1273

    

  • Packaging influences on the reliability of MEMS resonators.

    J.J.M. Zaal, W.D. van Driel, S. Bendida, Q. Li, J.T.M. Van Beek, G.Q. Zhang

    Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 8-9, 2008, págs. 1567-1571

    

  • Correlation studies for component level ball impact shear test and board level drop test.

    E.H. Wong, R. Rajoo, S.K.W. Seah, C.S. Selvanayagam, W.D. van Driel, J.F.J.M. Caers, X.J. Zhao, N. Owens, L.C. Tan, M. Leoni, P.L. Eu, Y.-S. Lai, C.-L. Yeh

    Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 7, 2008, págs. 1069-1078

    

  • The need for multi-scale approaches in Cu/low-k reliability issues.

    C.A. Yuan, O. van der Sluis, W.D. van Driel, G.Q. Zhang

    Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 6, 2008, págs. 833-842

    

  • Characterization of semiconductor interfaces using a modified mixed mode bending apparatus.

    J. Thijsse, O. van der Sluis, J.A.W. van Dommelen, W.D. van Driel, M.G.D. Geers

    Microelectronics reliability, ISSN 0026-2714, Vol. 48, Nº. 3, 2008, págs. 389-394

    

  • Facing the challenge of designing for Cu/low-k reliability.

    W.D. van Driel

    Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 12, 2007, págs. 1969-1974

    

  • Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion.

    O. van der Sluis, R.A.B. Engelen, R.B.R. Van Silfhout, W.D. van Driel, M.A.J. van Gils

    Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 12, 2007, págs. 1975-1982

    

  • Measuring the through-plane elastic modulus of thin polymer films in situ.

    M. van Soestbergen, L.J. Ernst, K.M.B. Jansen, W.D. van Driel

    Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 12, 2007, págs. 1983-1988

    

  • Molecular simulation on the material/interfacial strength of the low-dielectric materials.

    C.A. Yuan, O. van der Sluis, G.Q. Zhang (Kouchi), L.J. Ernst, W.D. van Driel, R.B.R. Van Silfhout

    Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 9-11, 2007, págs. 1483-1491

    

  • Characterization of moisture properties of polymers for IC packaging.

    X. Ma, K.M.B. Jansen, L.J. Ernst, W.D. van Driel, O. van der Sluis, G.Q. Zhang

    Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 9-11, 2007, págs. 1685-1689

    

  • Mechanical reliability challenges for MEMS packages: Capping.

    W.D. van Driel, D.G. Yang, C.A. Yuan, M. Van Kleef, G.Q. Zhang

    Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 9-11, 2007, págs. 1823-1826

    

  • Advanced structural similarity rules for the BGA package family.

    W.D. van Driel, A. Mavinkurve, M.A.J. van Gils, G.Q. Zhang

    Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 2-3, 2007, págs. 205-214

    

  • Virtual qualification of moisture induced failures of advanced packages.

    M.A.J. van Gils, W.D. van Driel, G.Q. Zhang, H.J.L. Bressers, R.B.R. van Shilfhout, X.J. Fan

    Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 2-3, 2007, págs. 273-279

    

  • Advanced numerical prototyping methods in modern engineering applications ¿ Optimisation for micro-electronic package reliability.

    A. Wymyslowski, W.D. van Driel, J. van de Peer, N. Tzannetakis, G.Q. Zhang

    Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 2-3, 2007, págs. 280-289

    

  • Correlation between chemistry of polymer building blocks and microelectronics reliability.

    H.J.L. Bressers, W.D. van Driel, K.M.B. Jansen, L.J. Ernst, G.Q. Zhang

    Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 2-3, 2007, págs. 290-294

    

  • Numerical modeling of warpage induced in QFN array molding process

    D.G. Yang, K.M.B. Jansen, L.J. Ernst, G.Q. Zhang, W.D. van Driel, H.J.L. Bressers, J.H.J. Janssen

    Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 2-3, 2007, págs. 310-318

    

  • On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections.

    J. W. C. de Vries, M.Y. Jansen, W.D. van Driel

    Microelectronics reliability, ISSN 0026-2714, Vol. 47, Nº. 2-3, 2007, págs. 444-449

    

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